Wet process CL 200

CL 200

Wet process


After laser cutting, the residue that results from laser cutting must be removed from the products. For this process, it is very important that the material does not suffer any micro cracks when being cleaned. Micro cracks in NiTinol reduce the products' service life.

The cleaning machine automatically performs the sequence of the cleaning process. The complete chemical cleaning process is made up of different steps. The stent is cleaned of laser slag, flushed and then dried in one sequence. The CL 200 has different trays for different cleaning processes and etching processes. The parts are transported automatically by an integrated handler. The freely programmable software can save many different programmes. The closed design warrants work protection.